Our solution for the invitation cover uses the actual Scanning Electron Microscope images of wafer coatings studied at the seminars as abstract typographic letterforms announcing the “Technology ’99” theme. The arresting format of interconnected squares evokes the grid pattern of chips within a wafer. Throughout the book, the unusual juxtaposition of scientific images with real-life scenes conveys seminar concepts in a fresh and engaging manner. The last spread encourages attendance by placing the conference in a historical perspective.